Laboratoire Hubert Curien

Manageress : Florence Garrelie
Research at the Laboratoire Hubert Curien (LabHC) focuses on optics, photonics and microwaves, and computer science, telecom and imaging. Core competences in optics, photonics and microwaves mainly concern surface engineering, the micro/nano structure of materials, laser processing, electromagnetic modeling and material resistance under extreme conditions and in harsh environments. Core competences in computer science, telecom and imaging are mainly machine learning, data mining, information retrieval, image science, computer vision, and applied cryptography.



Expertise provided by the Laboratoire Hubert Curien to LABEX covers :

• Radiation-matter interaction : advanced ultrafast laser processing & thin film deposition, surface micro / nano engineering, thin film and coating deposition processes, laser-based 3D photonics, predictive models of ultrafast and dynamics of laser-matter interactions, fast laser manufacturing, material and surface integrity in severe electromagnetic environments.
• Micro- and nano-structure : interaction of electromagnetic waves with micro/nano-structured dielectric, metallic and magnetic materials, electromagnetic modeling of subwavelength structures or nanoparticle assemblies, dielectric/metallic gratings, laser-induced and growth of functional nanoparticles for meta-materials and meta-surfaces, plasmonic surface structures, RF, microwave and optical planar integrated devices.
• Image science, computer vision and computer science : image formation, processing and extraction of content, image reconstruction, restoration, recognition, machine learning, data mining and personalized information retrieval for various applications. This approach can be implemented in different configurations, including in surface analysis, such as dynamic tribological contact.
• Technical platforms : FEG-SEM. Multi-wavelength Raman spectrometry. Multi-wavelength ellipsometry. Femto-, pico- & nano-laser processing. AFM. Photolithography. Wet and reactive Ion Beam Etching. Thin film deposition processes (Pulsed laser ablation, magnetron sputtering, thermal evaporation). Magneto-optical polarimeter. FEG TEM-EELS 30-200 kV (acquisition in 2018).